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  73 www.littelfuse.com ?2008 littelfuse speci?cations are subject to change without notice. electronics designers guide silicon protection arrays low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series description features applications this new broadband protection device from littelfuse provides overvoltage protection for applications such as 10/100/1000 baset ethernet, t3/e3 ds3 interfaces, adsl2+, and vdsl2+. this new protector combines the tvs diode element with a diode recti?er bridge to provide both longitudinal and differential protection in one package. this design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. this reduces intermodulation (im) distortion caused by a typical solid-state protection solution. the application schematic provides the connection information. pinout functional block diagram sp03-6 (so-8) series rohs pb green agency approvals - pending agency agency file number e128662 ? rohs compliant ? ms-012 surface mount package (jedec so-8) ? low insertion loss, log- linear capacitance ? combined longitudinal and metallic protection ? clamping speed of nanoseconds ? ul 94v-0 epoxy molding ? pending ul recognized component ? low clamping voltage ? t1/e1 line cards ? t3/e3 and ds3 interfaces ? sts-1 interfaces ? 10/100/1000 baset ethernet so-8 (top view) 1 2 3 5 4 6 7 8 pin 1 and 8 pin 4 and 5 ground pin 2, 3, 6, and 7 line out line out line in line in
www.littelfuse.com ?2008 littelfuse speci?cations are subject to change without notice. 74 electronics designers guide silicon protection arrays low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series absolute maximum ratings parameter rating units 1fbl1vmtf$vssfou ?t
150 a 1fbl1vmtf1pxfs ?t
2800 w *&$ %jsfdu%jtdibshf  -fwfm
8kv *&$ "js%jtdibshf  -fwfm
15 kv *&$ ?t
100 a #fmmdpsf(3 *ousb#vjmejoh
 ?t
100 a *56, ?t
 a electrical characteristics (t 01 = 25c) thermal information parameter rating units 40*$1bdlbhf 170 c/w 4upsbhf5fnqfsbuvsf3bohf -65 to 150 c .byjnvn+vodujpo5fnqfsbuvsf 150 c .byjnvn-fbe5fnqfsbuvsf 4pmefsjoht
 40*$-fbe5jqt0omz
300 c parameter symbol test conditions min typ max units 3fwfstf4uboe0gg7pmubhf v 38. ---6v 3fwfstf#sfblepxo7pmubhf v #3 i t = 1ma 6.8 - - v 3fwfstf-fblbhf$vssfou i 3 v 38. = 6v, t= 25c - - 25 ?" clamping voltage, line-ground v c i 11 = 50a, t p ?t --15v clamping voltage, line-ground v c i 11 = 100a, t p ?t - - 20 v junction capacitance c j v 3 7 g.)[ -1625pf v 3 7 g.)[ -812pf caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed.
75 www.littelfuse.com ?2008 littelfuse speci?cations are subject to change without notice. electronics designers guide silicon protection arrays low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series figure 2: current derating curve figure 4: clamping voltage vs. peak pulse current figure 6: forward voltage vs. forward current figure 1: non-repetitive peak pulse current vs. pulse time figure 3: pulse waveform figure 5: capacitance vs. reverse voltage pulse decay time (s) 1 10 100 1000 1 10 100 1000 peak pulse current (a) time, s 0 20 40 60 80 100 0 5 10 15 20 25 30 35 40 percentage of i pp (%) capacitance (pf) reverse voltage (v) 0 2 4 6 8 10 12 14 16 18 20 01234567 line-to-line line-to-ground p ercentage of rated current (%i p ) ambienttemperature (c) 0 20 40 60 80 100 120 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25 0 20406080100 v c clamping voltage (v) i p peak impulse current (a) line-to-line line-to-ground 0 1 2 3 4 5 6 7 0 102030405060708090100 forward current (a) f orw ard voltage (v) ground-to-line
www.littelfuse.com ?2008 littelfuse speci?cations are subject to change without notice. 76 electronics designers guide silicon protection arrays low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series application example the following schematic shows a high-speed data interface protection solution. the sp03-6 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. its surge rating is compatible with the intra-building surge requirements of telcordias gr-1089-core, and the basic level recommendations of itu k.20 and .21. this device protects against both positive and negative induced surge events. the telelink fuse provides overcurrent protection for the long term 50/60 hz power fault events. 1 2 3 4 8 7 6 5 to chipset (ethernet phy, t3/e3 phy, etc.) ring tip telelink (0461 1.2 5 ) sp03-6 re?ow condition pb C free assembly pre heat -temperature min (t s(min) ) 150c -temperature max (t s(max) ) 200c -time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) tot l - ramp-up rate 3c/second max re?ow -temperature (t l ) (liquidus) 217c -temperature (t l ) 60 C 150 seconds peaktemperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 2 5 c to peaktemperature (t p ) 8 minutes max. do not exceed 260c soldering parameters
77 www.littelfuse.com ?2008 littelfuse speci?cations are subject to change without notice. electronics designers guide silicon protection arrays low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series part numbering system product characteristics ordering information part number package marking min. order qty. 41#5( 40*$5bqf3ffm 41 2500 lead plating matte tin lead material copper alloy lead coplanarity jodift nn
subsitute material silicon body material .pmefe&qpyz flammability 6-7 series package working voltage silicon protection array xx xx xx x x x t = tape & reel g = green part marking system mechanical drawings and recommended solder pad outline symbol millimetres inches min max min max a 1.35 1.75 0.053  a1 0.10 0.25  0.010 a2 1.25 1.65  0.065 b 0.31 0.51 0.012 0.020 c 0.017 0.25 0.007 0.010 d  5.00   e 5.80 6.20 0.228  e1 3.80  0.150 0.157 e 1.27 bsc 0.050 bsc l  1.27 0.016 0.050 ms-012 (so-8) surface mount package o recommended soldering pad outlin e (reference only) f l first line: part number second line: date code f l sp03-6 xxxxxxxx notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. %jnfotjpotbsffydmvtjwfpgnpmenbtinfubmcvss "mmtqfdjmdbujpotdpnqmzup+&%&$41&$.0*ttvf" 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 1bdlbhftvsgbdfnbuufmojti7%*
www.littelfuse.com ?2008 littelfuse speci?cations are subject to change without notice. 78 electronics designers guide silicon protection arrays low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series embossed carrier tape & reel speci?cation - soic package symbol millimetres inches min max min max e 1.65 1.85 0.065 0.073 f  5.6 0.213 0.22 1  2.05 0.077 0.081 d 1.5 1.6  0.063 d1 1.50 min .jo 1    0.161 1     w   12.1   1 8.1 0.311  a0 6.3 6.5  0.256 b0 5.1 5.3 0.2  , 2 2.2  0.087 t 0.30 +/- 0.05 0.012 +/- 0.002 dimensions


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